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| Product parameters |
| Name: | Metal Bond Diamond Pad for EZ Change of HTC Grinding Head |
| Model Number: | BW-DPP-F-C05 |
| Segment Size: | 40x10x10mm |
| Grit No.: | #30, #40, #60, #80, #120, #150, #200 |
| Type: | Abrasive Disc |
| Segment shape: | 2 Bar Segmented |
| Segment No.: | 2 Pcs |
| Machine: | HTC grinding machines |
| Industry: | Concrete Grinding Tools |
| Application: | For Concrete floor restoration professional |
| Base Specification: | Standard for HTC grinding head |
| Bond Type: | Soft, Medium, Hard. |
| Grinding result: | Flat surface and even size |  |
Metal Bond Diamond Pad for EZ Change of HTC Grinding Head
2 Bar Segmented Type
Designed specifically for Concrete floor restoration professional, for quick removal of any materials, bonds Hard, Medium, or Soft available for kinds of concrete, used on EZ change of HTC grinding machines.
The bar segment is ideal for removing heavy coating. The bar segment is extremely aggressive leaving and deep to medium scratch pattern. The double segments remove adhesives, coating and lippage, taking the floor from coarsely structured surface to pre-polishing.
Bond: Soft,Medium,Hard.
The following are the normal Specifications we are selling:
| Code No. | Segment Size | Segment No. | Grit No. | Base Specification |
| BW-DPP-F-C05 | 40x10x10mm | 2 | #6, #16, #25, #30, #40, #50, #60, #80, #100, #120, #150, #170, #200 | Standard for HTC grinding head |
The above specification & photos is only for Reference, other specification or design can be ordered by customers.
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