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Product parameters |
HTC Resin Bond Diamond Polishing Pads
For HTC planetary concrete grinders
Suitable for EZ-change system of HTC Grinding Head
Easy tool changes
Plastic base, 12mm resin height, 5 Dots Type
Designed specifically for Concrete floor restoration professional, HTC's resin-bond diamond Grinding Pads are many times used after the use of metal-bond diamond tools for floor polishing. However, in some cases a resin-bond diamond tool can be used as a starting tool on smooth flat floors.
The following are the normal Specifications we are selling:
Code No. | Segment Height | Segment No. | Grit No. | Base Specification |
BW-DPP-F-C03 | 10mm | 5 |
50#, 100#, 200#, 400#, 800#, 1500#, 3000# |
Standard for HTC grinding head |
The above specification & photos is only for Reference, other specification or design can be ordered by customers.
Kindly Noted:
When order HTC Resin Bond Diamond Polishing Pads please Confirm:
Code No. of Resin Bond Diamond Polishing Pads
Segment Height ,Segment No.
Grit No.
Material Polishing: For Granite, or marble, or other material?
Use Type: Dry polishing or Wet polishing
Order Quantity & Expected Shipping Date
Special Requirements (If)