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HTC Resin Bond Diamond Polishing Pads

Product parameters
Name: HTC Resin Bond Diamond Polishing Pads
Model Number: BW-DPP-F-C03
Type: Wet or Dry use
Segment No.: 5 Dots Type
Segment height: 10mm
Base material: Plastic
Grit No.: 50#,100#,200#,400#, 800#,1500#,3000#
Machine: HTC planetary concrete grinders
Industry: Diamond tools
Application: Concrete floor restoration professional
Shape: HTC planetary
Polishing result: High gloss
Quality Class: Premium only
Base Specification: Standard for HTC grinding head

Product Description


HTC Resin Bond Diamond Polishing Pads


For HTC planetary concrete grinders
Suitable for EZ-change system of HTC
Grinding Head
Easy tool changes

Plastic base, 12mm resin height, 5 Dots Type

 

Designed specifically for Concrete floor restoration professional, HTC's resin-bond diamond Grinding Pads are many times used after the use of metal-bond diamond tools for floor polishing. However, in some cases a resin-bond diamond tool can be used as a starting tool on smooth flat floors.

 

 

The following are the normal Specifications we are selling:

 

Code No. Segment Height Segment No. Grit No. Base Specification
BW-DPP-F-C03 10mm 5

50#, 100#, 200#,

400#, 800#, 1500#,

3000#

Standard for HTC grinding head

 

 

The above specification & photos is only for Reference, other specification or design can be ordered by customers.

 

Kindly Noted:

 

When order HTC Resin Bond Diamond Polishing Pads please Confirm:

Code No. of  Resin Bond Diamond Polishing Pads
Segment Height ,Segment No.
Grit No.
Material Polishing: For Granite, or marble, or other material?
Use Type: Dry polishing or Wet polishing
Order Quantity & Expected Shipping Date
Special Requirements (If) 

 


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